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Project Planning Manual | Rexroth MTA 200
Index
A
Air pressure......................................................... 37
Analog module...................................................... 9
Appropriate use
Introduction .................................................. 11
B
Backlight tubes.................................................... 37
Battery............................................................... 114
BIOS settings
Special settings for MTA 200 ................. 67, 77
BTA 20.............................................................. 107
BT bus....................................................... 107, 111
Addressing ................................................. 112
BTM 15/16........................................................ 107
C
Charging times.................................................. 114
COM2.................................................................. 47
Component versions........................................... 89
COM user interface........................................... 111
Connector housing.............................................. 54
D
Degree of protection........................................... 37
Dimensions......................................................... 37
DIP switch................................................. 114, 119
Display unit......................................................... 37
DPM01.............................................................. 121
DPS01............................................................... 121
Drawer keyboard................................................... 8
E
Error display...................................................... 115
External keyboard............................................... 33
F
Fan...................................................................... 37
Fieldbus connections........................................ 107
Film pocket.......................................................... 33
Flash EPROM................................................... 107
Floppy-disk flap................................................... 25
Lockable ....................................................... 62
Front panel.......................................................... 37
G
Gateway module................................................... 9
H
Hand-held terminal................................................ 8
Electric Drives
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H
Hardware components
Additional components ................................... 8
Hardware watchdog.......................................... 111
Heat loss............................................................. 37
Housing opening................................................. 32
I
I/O interface X22............................................... 102
Image memory.................................................. 112
Inappropriate use................................................ 12
Consequences, exclusion of liability ............ 11
Input locale.......................................................... 34
INTERBUS loop................................................ 119
INTERBUS master connection................. 107, 118
Interface assignment................................. 116, 123
Internal foil keyboard........................................... 35
K
Keyboard............................................................. 37
Keyboard driver................................................... 33
Keyboard language............................................. 33
Keyboard layout.................................................. 33
Key labeling........................................................ 31
Key switch......................................................... 110
Key switches..................................................... 107
L
LPT1................................................................... 47
M
Machine function keys........................ 30, 107, 110
Machine operating keys.................................... 110
Max. external magnetic field............................... 37
Max. shock.......................................................... 37
Max. surrounding air temperature....................... 37
Max. temperature gradient.................................. 37
Max. vibration...................................................... 37
Measured value acquisitions................................. 8
Memory module.................................................. 72
Mini control panel.................................................. 8
MTS-P01.2........................................................ 107
MTS-P02.2........................................................ 107
N
NC bus.............................................................. 110
Network connections............................................. 8
O
OPEN_COM...................................................... 111
Operating status display................................... 115
Operating system................................................ 24
133/135
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